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4040 Yellow-Green SMD LED with 570-575nm Wavelength, 120° Viewing Angle, and 2000V ESD Protection

quality 4040 Yellow-Green SMD LED with 570-575nm Wavelength, 120° Viewing Angle, and 2000V ESD Protection factory
Product Specification
Place of Origin: CHINA
Brand Name: Weishibo
Certification: ROHS/SG/IMQ
Model Number: WS-C4040YGC-4J-1T
Minimum Order Quantity: 3000
Price: 0.05-0.2 US dollars
Payment Terms: L/C,D/A,D/P
Supply Ability: 10KK per month
Product Details
Highlight:

4040 SMD LED

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575nm SMD LED

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570nm white diode
Name: 4040 Side View Yellow-Green SMD LED Product Specification
Luminous Intensity: 60-120mcd
Dominant Wavelength: 570-575nm
Forward Voltage: 1.8-2.2V
Reverse Current: 10μA
Viewing Angle: 120
Continuous Forward Current: 20mA
Reverse Voltage: 5V
ESD(HBM): 2000V
Operating Temperature: -40~+85℃
Product Description
WS-C4040YGC-4J-1T 4040 Side View Yellow-Green SMD LED
Model WS-C4040YGC-4J-1T is a 4040 side-view yellow-green SMD LED with dimensions 4.0×4.0×3.55mm and rated power of 0.04W. It features an InGaN chip with transparent epoxy encapsulation, driven at standard 20mA. With dominant wavelength range of 570-575nm, luminous intensity of 60-120mcd, and forward voltage of 1.8-2.2V, this LED is rated MSL Level 5a and compatible with full SMT assembly and lead-free reflow soldering. Offering 2000V HBM ESD resistance and operating temperature from -40℃ to +85℃, it complies with RoHS and REACH standards. Ideal for automotive interior backlighting, instrument indicators, home appliances, industrial control panels, and light guide side backlighting applications.
Core Features
  • Standard 4.0×4.0mm side-emitting outline with 3.55mm height
  • 120° wide viewing angle for even lateral light output
  • Low 0.04W power consumption with stable yellow-green spectrum (570-575nm)
  • Luminous intensity from 60 to 120mcd
  • MSL Level 5a for outstanding moisture resistance
  • Clear epoxy package with excellent thermal and aging resistance
  • 2000V HBM ESD protection against electrostatic damage
  • Compliant with international RoHS & REACH environmental requirements
Material Specification
Part No. Chip Material Lens Type
WS-C4040YGC-4J-1T InGaN Transparent colloid
Absolute Maximum Ratings (TA=25℃)
Parameter Symbol Rating Unit
Power Dissipation Pd 40 mW
Continuous Forward Current IF 20 mA
Pulsed Forward Current (0.1ms, 1/10 Duty Cycle) IFP 40 mA
Reverse Voltage VR 5 V
ESD (HBM) ESD 2000 V
Operating Temperature Topr -40~+85 ℃
Storage Temperature Tstg -40~+85 ℃
Storage Humidity Humidity <60 %
Junction Temperature Tj ≤125 ℃
Electrical & Optical Characteristics (TA=25℃, IF=20mA)
Parameter Symbol Min Typ Max Unit
Luminous Intensity Iv 60 80 120 mcd
Dominant Wavelength λd 570 572.5 575 nm
Forward Voltage VF 1.8 2.0 2.2 V
Reverse Current IR - - 10 μA
Viewing Angle 2θ1/2 - 120 - deg
Notes: Luminous intensity tolerance ±15%; VF tolerance ±0.1V.
Reliability Test Conditions
Test Item Standard Condition Duration Qty Ac/Re
Reflow Test JESD22-A113 Max 260℃, 10s, 3 cycles 3 Times 30PCS 0/1
Temperature Cycle JESD22-A104 -40℃~120℃ 100 Cycles 200PCS 0/1
Powered Temp Cycle JESD22-A105 -40℃~85℃ powered 1000H 30PCS 0/1
High Temp & Humidity Test JESD22-A101 85℃, RH85%, 5/20mA 1000H 30PCS 0/1
High Temp Operating Life JESD22-A108 85℃, 20mA 1000H 30PCS 0/1
High/Low Temp Storage IEC60068-2-1 -40℃ / 85℃ 1000H 22PCS 0/1
Failure Standard: VF＞1.1×USL, IR＞10μA, Iv＜0.7×LSL are defined as defective.
Reflow Soldering Requirements
Only single reflow soldering is permitted; repeated reflow is prohibited.
Leaded solder: Peak ≤230℃, max heating rate 4℃/s, soak time over 120s at 140-160℃.
Lead-free solder: Peak ≤260℃, max heating rate 4℃/s, soak time over 120s at 180-200℃.
Packing Specification
Packed by tape & reel, 1503 pieces per reel. Cover tape peeling force: 0.1-0.7N under 10° peeling angle. Sealed with aluminum moisture-proof bag equipped with desiccant.
Storage & Operation Guidance
Unopened reels: Store at 0-30℃, RH＜60% in moisture-proof cabinet for maximum 60 days; perform first article inspection before production.
Opened reels: Finish all unpacked LEDs within 24 hours; bake residual LEDs at 60℃ for 12-24 hours before reuse. Never mix LEDs from different batches.
Assembly: Complete reflow process right after SMT mounting with full ESD protection.
Outdoor applications: Apply secondary lens plus potting glue instead of direct surface encapsulation; select low oxygen permeability adhesive.
Applications
  • Automotive electronics: Console button backlight, dashboard indicator, gear shift status lamp
  • Consumer electronics: Status indicator for home appliances, chargers and remote controls
  • Industrial control: Indicator lights for instruments, PLC modules and relays
  • Backlight field: Side light source for light guide plate and slim digital display
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surface mount led

smd led chip

SMD LED
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