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4040 Yellow Green SMD LED WS-C4040YGC-4J-1T 570-575nm 0.04W Automotive Backlight Indicator LED

Product Specification
Place of Origin: CHINA
Brand Name: Weishibo
Certification: ROHS/SG/IMQ
Model Number: WS-C4040YGC-4J-1T
Minimum Order Quantity: 3000
Price: 0.05-0.2 US dollars
Payment Terms: L/C,D/A,D/P
Supply Ability: 10KK per month
Product Details
Highlight:

4040 SMD LED

,

575nm SMD LED

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570nm white diode

Name: 4040 Side View Yellow-Green SMD LED Product Specification
Luminous Intensity: 60-120mcd
Dominant Wavelength: 570-575nm
Forward Voltage: 1.8-2.2V
Reverse Current: 10μA
Viewing Angle: 120
Continuous Forward Current: 20mA
Reverse Voltage: 5V
ESD(HBM): 2000V
Operating Temperature: -40~+85℃
Product Description

WS-C4040YGC-4J-1T 4040 Side View Yellow-Green SMD LED Product Specification

1. Product Overview

Model WS-C4040YGC-4J-1T is a 4040 side-view yellow-green SMD LED with dimension 4.0×4.0×3.55mm and rated power 0.04W. It adopts InGaN chip and transparent epoxy encapsulation, driven at standard 20mA. Dominant wavelength ranges 570~575nm, luminous intensity 60~120mcd and forward voltage 1.8~2.2V. Rated MSL Level 5a, compatible with full SMT assembly and lead-free reflow soldering. With 2000V HBM ESD resistance and operating temperature from -40℃ to +85℃, it complies with RoHS and REACH standards, widely used for automotive interior backlight, instrument indicators, home appliances, industrial control panels and light guide side backlighting.

2. Core Features

Standard 4.0×4.0mm side-emitting outline with 3.55mm height, 120° wide viewing angle for even lateral light output.

Low 0.04W power consumption, stable yellow-green spectrum between 570~575nm, luminous intensity from 60 to 120mcd.

MSL Level 5a ensures outstanding moisture resistance for long-term storage and mass SMT production.

Clear epoxy package features excellent thermal and aging resistance to pass strict reliability tests including thermal cycle and damp heat aging.

2000V HBM ESD protection effectively prevents electrostatic damage during production and assembly.

All products satisfy international RoHS & REACH environmental requirements.

3. Material Specification

Part No. Chip Material Lens Type
WS-C4040YGC-4J-1T InGaN Transparent colloid

4. Absolute Maximum Ratings (TA=25℃)

Parameter Symbol Rating Unit
Power Dissipation Pd 40 mW
Continuous Forward Current IF 20 mA
Pulsed Forward Current(0.1ms,1/10 Duty Cycle) IFP 40 mA
Reverse Voltage VR 5 V
ESD(HBM) ESD 2000 V
Operating Temperature Topr -40~+85
Storage Temperature Tstg -40~+85
Storage Humidity Humidity <60 %
Junction Temperature Tj ≤125

5. Electrical & Optical Characteristics (TA=25℃, IF=20mA)

Parameter Symbol Min Typ Max Unit
Luminous Intensity Iv 60 80 120 mcd
Dominant Wavelength λd 570 572.5 575 nm
Forward Voltage VF 1.8 2.0 2.2 V
Reverse Current IR - - 10 μA
Viewing Angle 2θ1/2 - 120 - deg
Notes: Luminous intensity tolerance ±15%; VF tolerance ±0.1V.

6. Reliability Test Conditions

Test Item Standard Condition Duration Qty Ac/Re
Reflow Test JESD22-A113 Max 260℃,10s,3 cycles 3 Times 30PCS 0/1
Temperature Cycle JESD22-A104 -40℃~120℃ 100 Cycles 200PCS 0/1
Powered Temp Cycle JESD22-A105 -40℃~85℃ powered 1000H 30PCS 0/1
High Temp & Humidity Test JESD22-A101 85℃,RH85%,5/20mA 1000H 30PCS 0/1
High Temp Operating Life JESD22-A108 85℃,20mA 1000H 30PCS 0/1
High/Low Temp Storage IEC60068-2-1 -40℃ / 85℃ 1000H 22PCS 0/1
Failure Standard: VF>1.1×USL, IR>10μA, Iv<0.7×LSL are defined as defective.

7. Reflow Soldering Requirements

Only single reflow soldering is permitted; repeated reflow is prohibited.

Leaded solder: Peak ≤230℃, max heating rate 4℃/s, soak time over 120s at 140~160℃.

Lead-free solder: Peak ≤260℃, max heating rate 4℃/s, soak time over 120s at 180~200℃.

8. Packing Specification

Packed by tape & reel, 1503 pieces per reel. Cover tape peeling force: 0.1~0.7N under 10° peeling angle. Sealed with aluminum moisture-proof bag equipped with desiccant.

9. Storage & Operation Guidance

Unopened reels: Store at 0~30℃, RH<60% in moisture-proof cabinet for maximum 60 days; perform first article inspection before production.

Finish all unpacked LEDs within 24 hours; bake residual LEDs at 60℃ for 12~24 hours before reuse. Never mix LEDs from different batches.

Complete reflow process right after SMT mounting with full ESD protection.

For outdoor lamp design: Apply secondary lens plus potting glue instead of direct surface encapsulation; select low oxygen permeability adhesive.

10. Application

Automotive electronics: Console button backlight, dashboard indicator, gear shift status lamp

Consumer electronics: Status indicator for home appliances, chargers and remote controls

Industrial control: Indicator lights for instruments, PLC modules and relays

Backlight field: Side light source for light guide plate and slim digital display

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